#VU126192 Heap-based Buffer Overflow in Qualcomm products - CVE-2026-21372

Vulnerability identifier: #VU126192

Vulnerability risk: Low

CVSSv4.0: CVSS:4.0/AV:L/AC:L/AT:N/PR:L/UI:N/VC:H/VI:H/VA:H/SC:N/SI:N/SA:N/E:U/U:Clear

CVE-ID: CVE-2026-21372

CWE-ID: CWE-122

Exploitation vector: Local access

Exploit availability: No public exploit available

Vulnerable software:
Cologne
FastConnect 6700
FastConnect 6900
FastConnect 7800
QCM5430
QCM6490
Qualcomm Video Collaboration VC3 Platform
Snapdragon 460 Mobile Platform
Snapdragon 662 Mobile Platform
Snapdragon 7c+ Gen 3 Compute
WCD9370
WCD9375
WCD9378C
WCD9380
WCD9385
WCN3950
WCN3988
WSA8840
WSA8845
WSA8845H
X2000077
X2000086
X2000090
X2000092
X2000094
XG101002
XG101032
XG101039

Software vendor:
Qualcomm

The vulnerability allows a local application to execute arbitrary code.

The vulnerability exists due to improper input validation in Power Management IC. A local application can execute arbitrary code.

Install security update from vendor's website.

• https://docs.qualcomm.com/securitybulletin/april-2026-bulletin.html